SOP - Suzhou Zhen Kun Technology Limited

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Product description:

SOP packaging is a kind of surface installation technology. It welded the pins of electronic components on the surface of the printing circuit board, which can improve reliability and electrical. SOP packaging has highly automated manufacturing and assembly capabilities, which can effectively reduce production costs.

Applications:

Consumer electronics, vehicle electronics and other applications.

Technical characteristics:

Number of pins 8L & amp; 16L;

The thickness of the product contains 0.88mm, 1.75mm, 2.16mm, and 2.5mm;

You can provide a multi -dimensional line diameter of the golden wire/plating copper wire;

Can provide stacking structure design.

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BGA LGA QFN/DFN SOP

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Service Hotline:+86-512-62535188
Address:183 Fangzhou Road, Industrial Park, Suzhou City, Jiangsu Province
Mail:cn_yang@kltech.com.cn

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